New potting material: expandable polystyrene bead foam

Journal Article · Fri Dec 31 23:00:00 EST 1976 · J. Cell. Plast.; (United States)

DOI:https://doi.org/10.1177/0021955X7701300510· OSTI ID:6692228

Fossey, D J ^[1]; Smith, C H; Wischmann, K B

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1. Bendix Corp., Kansas City, MO

Many present-day electronic packages are designed using sophisticated and expensive circuitry. A potting material that could be easily removed with common solvents was needed to reduce the cost and time of reworking defective components in these units. Polystyrene bead foam (PSBF) appeared to have several advantages over conventional encapsulants such as rigid polyurethane foam and filled epoxy compounds for this application. The density of the PSBF can be readily adjusted from 0.02 g/cm/sup 3/ to 0.60 g/cm/sup 3/ and easily dissolved in most hydrocarbon solvents with minimal damage to other plastic parts and electrical components in the unit. In addition, it is relatively inexpensive, requires very little clean-up, and is an excellent shock absorbing material.

• OSTI ID: 6692228
• Journal Information: J. Cell. Plast.; (United States), Journal Name: J. Cell. Plast.; (United States) Vol. 13:5; ISSN JCUPA
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360401 -- Polymers & Plastics-- Preparation & Fabrication-- (-1987)
37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CHEMISTRY
400301* -- Organic Chemistry-- Chemical & Physicochemical Properties-- (-1987)
COLLOIDS
DISPERSIONS
DISSOLUTION
ELECTRONIC EQUIPMENT
ENCAPSULATION
FOAMS
MELTING
ORGANIC COMPOUNDS
ORGANIC POLYMERS
PETROCHEMICALS
PETROLEUM PRODUCTS
PHASE TRANSFORMATIONS
PHYSICAL PROPERTIES
PLASTICS
POLYMERS
POLYOLEFINS
POLYSTYRENE
POLYVINYLS
TEMPERATURE DEPENDENCE