Evaluation of polystyrene bead foam as an encapsulant for electonic packages. Final report
This experimental stress analysis evaluates polystyrene bead foam (PSBF) as an encapsulant. Direct comparison data are included for polyurethane foam encapsulation. Thermal stresses on solder joints using a thumb tack test are compared for these foam encapsulants and GMB/epoxy. Special transducer designs are used to measure thermomechanical stresses and deflections. Failure criteria for some of the electronic components involved are delineated. The mechanical properties of potting polystyrene bead foam is presented and compared with the properties of structural polystyrene bead foam. The thermomechanical load and deflection data and the transducers developed are aids for making stress analysis in other foam encapsulated units. Polystyrene bead foam is concluded to be a safe encapsulant for certain electronic packages, but polyurethane foam is not.
- Research Organization:
- Bendix Corp., Kansas City, MO (USA)
- DOE Contract Number:
- EY-76-C-04-0613
- OSTI ID:
- 6213009
- Report Number(s):
- BDX-613-2021(Rev.)
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
420800* -- Engineering-- Electronic Circuits & Devices-- (-1989)
COMPRESSION STRENGTH
DATA
DATA FORMS
ELECTRONIC EQUIPMENT
EVALUATED DATA
EVALUATION
GRAPHS
INFORMATION
MATERIALS
MECHANICAL PROPERTIES
NUMERICAL DATA
ORGANIC COMPOUNDS
ORGANIC POLYMERS
PETROCHEMICALS
PETROLEUM PRODUCTS
PLASTICS
POLYMERS
POLYOLEFINS
POLYSTYRENE
POLYVINYLS
POTTING MATERIALS
TABLES
TENSILE PROPERTIES
USES