Mechanical properties of polystyrene bead encapsulation foam
The tensile and compressive properties of polystyrene bead foam used as an encapsulant for electronic devices were determined for densities ranging from 0.3 to 0.6 g/cm/sup 3/. Data were generated for these properties at -54, 25, and 74/sup 0/C. Data previously reported for 0.2 g/cm/sup 3/ are included.
- Research Organization:
- Bendix Corp., Kansas City, MO (USA)
- DOE Contract Number:
- AC04-76DP00613
- OSTI ID:
- 5314784
- Report Number(s):
- BDX-613-2412
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
36 MATERIALS SCIENCE
360403* -- Materials-- Polymers & Plastics-- Mechanical Properties-- (-1987)
COLLOIDS
COMPRESSION
DENSITY
DISPERSIONS
ELECTRONIC EQUIPMENT
ENCAPSULATION
FOAMS
MECHANICAL PROPERTIES
ORGANIC COMPOUNDS
ORGANIC POLYMERS
PETROCHEMICALS
PETROLEUM PRODUCTS
PHYSICAL PROPERTIES
PLASTICS
POLYMERS
POLYOLEFINS
POLYSTYRENE
POLYVINYLS
360403* -- Materials-- Polymers & Plastics-- Mechanical Properties-- (-1987)
COLLOIDS
COMPRESSION
DENSITY
DISPERSIONS
ELECTRONIC EQUIPMENT
ENCAPSULATION
FOAMS
MECHANICAL PROPERTIES
ORGANIC COMPOUNDS
ORGANIC POLYMERS
PETROCHEMICALS
PETROLEUM PRODUCTS
PHYSICAL PROPERTIES
PLASTICS
POLYMERS
POLYOLEFINS
POLYSTYRENE
POLYVINYLS