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Moisture penetration evaluation of polystyrene bead foam as an encapsulant for electronic packages

Technical Report ·
DOI:https://doi.org/10.2172/5347302· OSTI ID:5347302

Discs of polystyrene bead foam were used to measure resistance to high-pressure moisture penetration. Densities of 0.2, 0.3, 0.4, 0.5, and 0.6 g/cm/sup 3/ processed at various fusion times and temperatures were tested. Only three fusion conditions for 0.6 g/cm/sup 3/ density were impervious to moisture penetration at 1724 kPa for 24 hours or more.

Research Organization:
Bendix Corp., Kansas City, MO (USA)
DOE Contract Number:
AC04-76DP00613
OSTI ID:
5347302
Report Number(s):
BDX-613-2394
Country of Publication:
United States
Language:
English

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Related Subjects

36 MATERIALS SCIENCE
360404* -- Materials-- Polymers & Plastics-- Physical Properties-- (-1987)
COLLOIDS
DIFFUSION
DISPERSIONS
ELECTRONIC EQUIPMENT
ENCAPSULATION
FOAMS
HYDROGEN COMPOUNDS
MOISTURE
ORGANIC COMPOUNDS
ORGANIC POLYMERS
OXYGEN COMPOUNDS
PETROCHEMICALS
PETROLEUM PRODUCTS
PLASTICS
POLYMERS
POLYOLEFINS
POLYSTYRENE
POLYVINYLS
PRESSURE DEPENDENCE
SORPTIVE PROPERTIES
SURFACE PROPERTIES
WATER