Mechanical properties of 0. 2 g/cm/sup 3/ polystyrene bead foam

Technical Report · Sun Jan 01 04:00:00 EST 1978

DOI:https://doi.org/10.2172/5020133· OSTI ID:5020133

Fossey, D J

In order to better interpret the results from a strain gage investigation of the effects of stress induced by polystyrene bead foam (PSBF) on electronic devices, the tensile and compressive properties of 0.2 g/cm/sup 3/ potting PSBF needed to be determined. These data are also required for mathematical models being employed to predict the force PSBF may exert on components. The properties were determined to be a function of temperature and residual pentane (blowing agent) content at -54/sup 0/, 25/sup 0/, and 74/sup 0/C. Both as-molded pentane content (1.4%) and heat-aged pentane content (less than 0.2%) were evaluated. Five specimens were tested at each condition. The material evaluated was BF-61 expandable polystyrene bead obtained from the BASF Corporation and molded to simulate the foam used for potting electronic components.

• Research Organization: Bendix Corp., Kansas City, Mo. (USA)
• DOE Contract Number: EY-76-C-04-0613
• OSTI ID: 5020133
• Report Number(s): BDX-613-1725(Rev.)
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360401* -- Polymers & Plastics-- Preparation & Fabrication-- (-1987)
CASTING
COLLOIDS
DISPERSIONS
ELECTRONIC CIRCUITS
FABRICATION
FOAMS
ORGANIC COMPOUNDS
ORGANIC POLYMERS
PACKAGING
PETROCHEMICALS
PETROLEUM PRODUCTS
PLASTICS
POLYMERS
POLYOLEFINS
POLYSTYRENE
POLYVINYLS
STRESSES
TEMPERATURE DEPENDENCE