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Silicon implantation in GaAs

Journal Article · · Appl. Phys. Lett.; (United States)
DOI:https://doi.org/10.1063/1.90715· OSTI ID:6782862

The electrical properties of room-temperature Si implants in GaAs have been studied. The implantations were done at 300 keV with doses ranging from 1.7 x 10/sup 13/ to 1.7 x 10/sup 15/ cm/sup -2/. The implanted samples were annealed with silicon nitride encapsulants in H/sub 2/ atmosphere for 30 min at temperatures ranging from 800 to 900/sup 0/C to electrically activate the implanted ions. Results show that the implanted layers are n type, which implies that the Si ions preferentially go into Ga sites substitutionally. For low-dose implants, high (approx.90%) electrical activation of the implanted ions is achieved and the depth distribution of the free-electron concentration in the implanted layer roughly follows a Gaussian. However, for high-dose implants, the activation is poor (<15% for a 900 /sup 0/C anneal) and the electron concentration profile is flat and deeper than the expected range.

Research Organization:
California Institute of Technology, Pasadena, California 91125
OSTI ID:
6782862
Journal Information:
Appl. Phys. Lett.; (United States), Journal Name: Appl. Phys. Lett.; (United States) Vol. 34:2; ISSN APPLA
Country of Publication:
United States
Language:
English