Contamination problems during surface cleaning for thermocompression bonding

Conference · Fri Jun 01 04:00:00 EDT 1984

OSTI ID:6736225

Raut, M K; Vaughan, J G

Recently, chromium/evaporated gold titanium/palladium/electroplated gold thin-film hybrid microcircuits experienced delamination problems during the thermocompression bonding of beam-leaded semiconductors and ribbon crossovers. The surface analysis showed that hydrogen peroxide cleaning of the microcircuits deposited tin on the gold bond pads. The bonding problem was believed to result from tin contamination on the surface. Further evaluations showed that only the ribbon crossover bonds were affected by the tin contamination and that the delaminations of the beam-leaded devices were caused by carbon contamination. Improved alternative surface cleaning methods were evaluated and implemented for both the beam-lead devices and the thin-film microcircuits.

• Research Organization: Bendix Corp., Kansas City, MO (USA); Mississippi Univ., University (USA). School of Engineering
• DOE Contract Number: AC04-76DP00613
• OSTI ID: 6736225
• Report Number(s): BDX-613-3069; CONF-840617-2; ON: DE84013066
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
420800* -- Engineering-- Electronic Circuits & Devices-- (-1989)
BONDING
CHROMIUM
CLEANING
CONTAMINATION
ELECTRONIC CIRCUITS
ELEMENTS
FABRICATION
FILMS
GOLD
JOINING
METALS
MICROELECTRONIC CIRCUITS
PALLADIUM
PLATINUM METALS
SURFACE CLEANING
SURFACE FINISHING
THIN FILMS
TITANIUM
TRANSITION ELEMENTS