Nondestructive testing of thermocompression bonds. Final report
A Scanning Laser Acoustic Microscope (SLAM) was used to characterize hybrid microcircuit beam lead bonds formed on thin film networks by a thermocompression process. Results from subsequent pull testing show that the SLAM offered no significant advantage over visual inspection for detecting bad bonds. Infrared microscopy and resistance measurements were also reviewed and rejected as being ineffective inspection methods.
- Research Organization:
- Bendix Corp., Kansas City, MO (USA)
- DOE Contract Number:
- AC04-76DP00613
- OSTI ID:
- 6609936
- Report Number(s):
- BDX-613-2518
- Country of Publication:
- United States
- Language:
- English
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