Replacement of hydrogen peroxide cleaning with oxygen plasma

Technical Report · Sun Mar 01 04:00:00 EST 1992

OSTI ID:5835243

Adams, B E

Comparison between the standard peroxide cleaning method and an oxygen plasma modified version was run on thin film bond monitors. The plasma modified version substituted oxygen plasma for the peroxide cleaning step in the process and reduced the DI rinse water temperature from 75{degrees}C to 25{degrees}C. A direct surface cleanliness comparison was made between the two cleaning methods using Auger spectroscopy. A beam lead and ribbon bonding experiment was also run on plasma-cleaned networks. Results of both experiments indicate that plasma cleaning is superior to peroxide cleaning and that reliable bonding can be done on plasma-cleaned thin film networks. 3 refs.

• Research Organization: Allied-Signal Aerospace Co., Kansas City, MO (United States). Kansas City Div.
• Sponsoring Organization: DOE; USDOE, Washington, DC (United States)
• DOE Contract Number: AC04-76DP00613
• OSTI ID: 5835243
• Report Number(s): KCP-613-4653; ON: DE92009020
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
426000* -- Engineering-- Components
Electron Devices & Circuits-- (1990-)
AUGER EFFECT
CLEANING
COMPARATIVE EVALUATIONS
ELECTRONIC CIRCUITS
ELEMENTS
EVALUATION
HYDROGEN COMPOUNDS
HYDROGEN PEROXIDE
NONMETALS
OXYGEN
OXYGEN COMPOUNDS
PEROXIDES
PLASMA
PRINTED CIRCUITS
SPECTROSCOPY
SURFACE CLEANING
SURFACE FINISHING