Skip to main content
U.S. Department of Energy
Office of Scientific and Technical Information

cw argon laser annealing of ion-implanted silicon

Journal Article · · Appl. Phys. Lett.; (United States)
DOI:https://doi.org/10.1063/1.90429· OSTI ID:6674872
We report on the annealing behavior of ion-implanted silicon exposed to cw argon laser radiation. The quality of the annealing was studied using channeling, in situ reflectivity, phase-contrast microscopy, and electrical resistivity. Strong dependence of anneal quality on laser power, crystal orientation, and implant dose is reported. Reflectivity measurements with a focused probing laser show that the onset of annealing occurs just below the melting point, and the annealing extends into the region where a thin layer of liquid silicon is formed at the crystal surface. We conclude that the physical mechanism responsible for crystal recovery is similar to the solid-state epitaxial regrowth observed for over-annealed samples.
Research Organization:
Bell Laboratories, Murray Hill, New Jersey 07974
OSTI ID:
6674872
Journal Information:
Appl. Phys. Lett.; (United States), Journal Name: Appl. Phys. Lett.; (United States) Vol. 33:6; ISSN APPLA
Country of Publication:
United States
Language:
English

Similar Records

Study of the mechanism of cw laser annealing of arsenic-implanted silicon
Journal Article · Sat Mar 31 23:00:00 EST 1979 · J. Appl. Phys.; (United States) · OSTI ID:6119036

Laser annealing of ion implanted silicon
Conference · Sat Apr 14 23:00:00 EST 1979 · AIP (Am. Inst. Phys.) Conf. Proc.; (United States) · OSTI ID:6260307

Electrical properties and annealing kinetics study of laser-annealed ion-implanted silicon
Conference · Sat Apr 14 23:00:00 EST 1979 · AIP (Am. Inst. Phys.) Conf. Proc.; (United States) · OSTI ID:6228493