Skip to main content
U.S. Department of Energy
Office of Scientific and Technical Information

Electrical properties and annealing kinetics study of laser-annealed ion-implanted silicon

Conference · · AIP (Am. Inst. Phys.) Conf. Proc.; (United States)
OSTI ID:6228493
This paper describes measurements of electrical properties and the regrowth behavior of ion-implanted silicon annealed with an 80-ns (FWHM) laser pulse at 1.06 ..mu..m. The experimental results include: (1) a determination of threshold energy density required for melting using a transient optical reflectivity technique, (2) measurements of dopant distribution using Rutherford backscattering spectroscopy, (3) characterization of electrical properties by measuring reverse leakage current densities of laser-annealed and thermal-annealed mesa diodes, (4) determination of annealed junction depth using an electron-beam-induced-current technique, and (5) a deep-level-transient spectroscopic study of residual defects. In particular, by measuring these properties of a diode annealed at a condition near the threshold energy density for liquid phase epitaxial regrowth, we have found certain correlations among these various annealing behaviors and electrical properties of laser-annealed ion-implanted silicon diodes.
Research Organization:
General Electric Research and Development Center, Schenectady, New York 12301
OSTI ID:
6228493
Report Number(s):
CONF-781121-
Conference Information:
Journal Name: AIP (Am. Inst. Phys.) Conf. Proc.; (United States) Journal Volume: 50:1
Country of Publication:
United States
Language:
English