Pulsed excimer laser (308 nm) annealing of ion implanted silicon and solar cell fabrication
A pulsed ultraviolet excimer laser (XeCl, 308 nm wavelength, 40 nsec FWHM pulse duration) has been successfully used for laser annealing of both boron- and arsenic-implanted silicon. TEM, SIMS, and sheet electrical measurements are used to characterize specimens. C-V and I-V measurements demonstrate that near-ideal p-n junctions are formed (diode perfection factor A = 1.2). Electrical activation of implanted ions by single laser pulses is essentially complete for energy densities E/sub l/ greater than or equal to 1.4 J/cm/sup 2/, far below the threshold for substantial surface damage --4.5 J/cm/sup 2/. Melting model calculations are in good agreement with observed thresholds for dopant redistribution and for epitaxial regrowth. Changes in annealing behavior resulting from multiple (1,2,5) laser pulses are also reported. Finally, the authors demonstrate the use of scanned overlapping excimer laser pulses for fabrication of large area (2 cm/sup 2/) solar cells with good performance characteristics. In contrast to pulsed ruby laser annealing, high open circuit voltages can be obtained without the use of substrate heating.
- Research Organization:
- Oak Ridge National Lab., TN
- DOE Contract Number:
- W-7405-ENG-26
- OSTI ID:
- 6692944
- Journal Information:
- Mater. Res. Soc. Symp. Proc.; (United States), Vol. 13
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
14 SOLAR ENERGY
P-N JUNCTIONS
ELECTRICAL PROPERTIES
SILICON
ANNEALING
SOLAR CELLS
FABRICATION
ARSENIC
BORON
LASER RADIATION
PULSED IRRADIATION
DIRECT ENERGY CONVERTERS
ELECTROMAGNETIC RADIATION
ELEMENTS
EQUIPMENT
HEAT TREATMENTS
IRRADIATION
JUNCTIONS
PHOTOELECTRIC CELLS
PHOTOVOLTAIC CELLS
PHYSICAL PROPERTIES
RADIATIONS
SEMICONDUCTOR JUNCTIONS
SEMIMETALS
SOLAR EQUIPMENT
360601* - Other Materials- Preparation & Manufacture
140501 - Solar Energy Conversion- Photovoltaic Conversion