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Radiation hardening of CMOS technologies: an overview

Conference · · IEEE Trans. Nucl. Sci.; (United States)
OSTI ID:6633828
The current status of four technologies for manufacturing radiation-hardened complementary metal-oxide-semiconductor integrated circuits is presented. The technologies include both aluminum-gate and silicon-gate CMOS structures formed on bulk-silicon and on silicon-on-sapphire (SOS) substrates. The hardness level achieved on large-scale integrated circuits fabricated in each of these technologies is given. In addition some historical background is included.
Research Organization:
RCA Corp., Somerville, NJ
OSTI ID:
6633828
Conference Information:
Journal Name: IEEE Trans. Nucl. Sci.; (United States) Journal Volume: NS-24:6
Country of Publication:
United States
Language:
English