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Fluorine in low-pressure chemical vapor deposited W/Si contact structures: Inclusion and thermal stability

Journal Article · · Appl. Phys. Lett.; (United States)
DOI:https://doi.org/10.1063/1.97811· OSTI ID:6617816
Concentration distributions of fluorine in low-pressure chemical vapor deposited W/(100)Si structures have been studied by the nuclear resonance broadening technique through the reaction /sup 19/F( p,..cap alpha gamma..)/sup 16/O. In unannealed structures the total fluorine content (4.8 x 10/sup 15/ at. cm/sup -2/) was chiefly concentrated around the W/Si interface. No loss or redistribution of fluorine was observed on annealing at a temperature of 600 /sup 0/C or below where no silicide formation took place. About 20% reduction of the fluorine content was observed after annealing at 700 /sup 0/C and above where WSi/sub 2/ formation occurred. No evidence of fluorine diffusion into the silicon substrate was seen for annealing up to 900 /sup 0/C for 1 h.
Research Organization:
Royal Institute of Technology, Microwave Department, Box 70033, S-10044 Stockholm, Sweden
OSTI ID:
6617816
Journal Information:
Appl. Phys. Lett.; (United States), Journal Name: Appl. Phys. Lett.; (United States) Vol. 50:21; ISSN APPLA
Country of Publication:
United States
Language:
English