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Study of the low-pressure chemical-vapor-deposited tungsten-silicon interface: Interfacial fluorine

Journal Article · · J. Appl. Phys.; (United States)
DOI:https://doi.org/10.1063/1.342820· OSTI ID:6445545
Single-crystal silicon <100> substrates uniformly doped at approx. >12 ..cap omega.. cm with boron were deposited with approx.800 A of low-pressure chemically vapor deposited W in a hot-quartz-walled (Anicon) system at a deposition temperature of 300 /sup 0/C. The samples studied include an as-deposited sample and two others which were post-deposition annealed at 600 /sup 0/C in Ar for 15 min each. X-ray photoelectron spectroscopy (XPS) coupled with an Ar/sup +/ ion sputter profiling technique was employed to investigate these structures as a function of depth. Particular emphasis was placed on the depth distribution, content, and chemical state of the fluorine present. Rutherford backscattering spectrometry and x-ray diffraction were used to corroborate the XPS data. Results show that, for the as-deposited and 600 /sup 0/C annealed sample, the maximum concentration of fluorine (0.6--0.8 at. %) is observed, not at the W/Si interface, but rather at the W (H/sub 2/ reduction)/W (Si displacement) interface. For the sample annealed at 850 /sup 0/C, WSi/sub 2/ is formed in the overlayer, and the peak in the F profile corresponds to the position of the WSi/sub 2//Si interface. The maximum concentration of fluorine is reduced by approximately 75% to 0.23 at. % in this sample. From the XPS spectra of the F 1s region, the chemical species of fluorine present in these samples have been identified as WF/sub 6/, WF/sub 5/, and WF/sub 4/.
Research Organization:
Surface Science Laboratory, East Texas State University, Commerce, Texas 75428
OSTI ID:
6445545
Journal Information:
J. Appl. Phys.; (United States), Journal Name: J. Appl. Phys.; (United States) Vol. 65:6; ISSN JAPIA
Country of Publication:
United States
Language:
English