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Comparison between thermal annealing and ion mixing of multilayered Ni-W films on Si. II

Journal Article · · J. Appl. Phys.; (United States)
DOI:https://doi.org/10.1063/1.335550· OSTI ID:6323791
The reactions between bilayered Ni/W films and Si<100> substrates induced by thermal annealing and ion mixing were investigated and compared. Samples were prepared by electron-beam sequential deposition of Ni and W onto the Si<100> substrates and following by either furnace annealing (approx. 200--900/sup 0/C) or ion mixing (approx. 2 x 10/sup 15/ -- 4 x 10/sup 16/ /sup 86/Kr/sup +/ ions/cm/sup 2/). The reactions were analyzed by Rutherford backscattering and x-ray diffraction (Read camera). Thermal annealing of both W/Ni/Si<100> and Ni/W/Si<100> samples led to the formation of Ni silicide next to the Si substrate and W silicide on the sample surface (layer reversal between Ni and W in the Ni/W/Si<100> case). Ion mixing of W/Ni/Si<100> samples led to the formation of Ni silicide with a thin layer of Ni-W-Si mixture located at the sample surface. For Ni/W/Si<100> samples a ternary amorphous mixture of Ni-W-Si was obtained with ion mixing. These reactions were rationalized in terms of the mobilities of various atoms and the intermixings between layers.
Research Organization:
Department of Electrical Engineering and Computer Sciences, University of California, San Diego, La Jolla, California 92093
DOE Contract Number:
FG03-84ER45156
OSTI ID:
6323791
Journal Information:
J. Appl. Phys.; (United States), Journal Name: J. Appl. Phys.; (United States) Vol. 58:11; ISSN JAPIA
Country of Publication:
United States
Language:
English