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Rapid thermal annealing of oxygen-vacancy centers in O-implanted silicon

Conference ·
OSTI ID:6544738
Infrared absorption by localized vibrational modes has been used to investigate rapid thermal annealing (RTA) of oxygen-vacancy (O-V) defects in O-implanted Si. At least three processes are involved in the annealing of O-V defects. An activation energy of 1.0 /sup + -/ 0.2 eV for a process leading to O/sub 2/-V formation is attributed to O-V diffusion. The final O-V annealing stage is attributed to oxygen clustering around O/sub 2/-V centers. Processes observed here in RTA are expected to be operative during implantation at the temperatures (400 to 600/sup 0/C) used for production of silicon-on-insulator structures.
Research Organization:
Sandia National Labs., Albuquerque, NM (USA)
DOE Contract Number:
AC04-76DP00789
OSTI ID:
6544738
Report Number(s):
SAND-86-2644C; CONF-870438-12; ON: DE87008645
Country of Publication:
United States
Language:
English