Polymeric-foam encapsulants for electronic devices
Different encapsulants for sophisticated electronic packages have been developed. Each encapsulant has advantages and disadvantages. The preference of one of these encapsulants to another will require tradeoffs. Syntactic epoxy foams have high strengths, but low densities are not obtainable. The chemically blown epoxy and polyutethane foams have the low-density capability along with lower strengths, compared with syntactic foams. Both the epoxy and polyurethane foams limit the reworkability of the electronic packages. The recently developed polystyrene foam system gives the designer a rework capability but limits the upper use temperature. The service temperature capabilities of some of the electronic components in the package may have to be considered in using the high-temperature polystyrene copolymer foam. Processing temperatures required for this foam system are sufficiently high to possible damage some components in the package. 3 tables.
- Research Organization:
- Bendix Corp., Kansas City, MO (USA)
- DOE Contract Number:
- AC04-76DP00613
- OSTI ID:
- 6540283
- Report Number(s):
- BDX-613-2866; CONF-830303-8; ON: DE83004139
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
360404* -- Materials-- Polymers & Plastics-- Physical Properties-- (-1987)
42 ENGINEERING
420800 -- Engineering-- Electronic Circuits & Devices-- (-1989)
COLLOIDS
COMPARATIVE EVALUATIONS
DISPERSIONS
DOCUMENT TYPES
ELECTRICAL PROPERTIES
ELECTRONIC CIRCUITS
ENCAPSULATION
EPOXIDES
FOAMS
MATERIALS
ORGANIC COMPOUNDS
ORGANIC OXYGEN COMPOUNDS
ORGANIC POLYMERS
PETROCHEMICALS
PETROLEUM PRODUCTS
PHYSICAL PROPERTIES
PLASTIC FOAMS
PLASTICS
POLYAMIDES
POLYMERS
POLYOLEFINS
POLYSTYRENE
POLYURETHANES
POLYVINYLS
REVIEWS
SYNTHETIC MATERIALS