Removable foam encapsulants

Conference · Thu Dec 31 23:00:00 EST 1981

OSTI ID:5041548

Wischmann, K. B.

This paper describes the use of two different expandable bead foams as solvent removable encapsulants; specifically they are polystyrene (STYROPOR BF-414, BASF Wyandotte) and a styrenemaleic anhydride copolymer (DYTHERM X214, ARCO/Polymers). These expandable bead foams are commercially available and normally used in insulating applications. However, they have been adapted to the unusual task of encapsulating sophisticated and expensive electronic hardware which requires a rework capability. The respective foams processing, resultant properties and removal methods are discussed in detail in this paper.

• Research Organization: Sandia National Labs., Albuquerque, NM (USA)
• DOE Contract Number: AC04-76DP00789
• OSTI ID: 5041548
• Report Number(s): SAND-82-0663; CONF-821010-1; ON: DE82017026
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360401* -- Polymers & Plastics-- Preparation & Fabrication-- (-1987)
42 ENGINEERING
420800 -- Engineering-- Electronic Circuits & Devices-- (-1989)
CHEMICAL PREPARATION
CHEMICAL REACTIONS
COLLOIDS
COPOLYMERS
DISPERSIONS
ELECTRONIC EQUIPMENT
EQUIPMENT
FOAMS
MATERIALS
ORGANIC COMPOUNDS
ORGANIC POLYMERS
PACKAGING
PETROCHEMICALS
PETROLEUM PRODUCTS
PLASTIC FOAMS
PLASTICS
POLYMERS
POLYOLEFINS
POLYSTYRENE
POLYVINYLS
SYNTHESIS
SYNTHETIC MATERIALS
TRANSPORT