Removable encapsulants for electronic devices

Conference · Thu Jan 01 04:00:00 EST 1987

OSTI ID:6615581

Wischmann, K B

Expensive and complex electronic hardware that have been encapsulated for mechanical and electrical protection often necessitates a rework capability. Unfortunately, most encapsulants are difficult to penetrate either by mechanical means or solvent attack. Usually, these approaches result in component damage. This paper describes the development of three different solvent removable thermoplastic encapsulants that exhibit varying upper use temperatures (80 to 130/sup 0/C) and physical properties. Two materials are based on expandable bead foam technology, while the third is a polyurethane casting resin. Functional electronic components have been successfully potted and depotted, a capability which has resulted in sizeable cost savings in production situations.

• Research Organization: Sandia National Labs., Albuquerque, NM (USA)
• DOE Contract Number: AC04-76DP00789
• OSTI ID: 6615581
• Report Number(s): SAND-87-0077C; CONF-870674-1; ON: DE87005869
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360600* -- Other Materials
42 ENGINEERING
420800 -- Engineering-- Electronic Circuits & Devices-- (-1989)
COLLOIDS
COMPARATIVE EVALUATIONS
COMPRESSION STRENGTH
DISPERSIONS
DISSOLUTION
ELECTRONIC CIRCUITS
ENCAPSULATION
FOAMS
MATERIALS
MECHANICAL PROPERTIES
ORGANIC COMPOUNDS
ORGANIC POLYMERS
PETROCHEMICALS
PETROLEUM PRODUCTS
PLASTIC FOAMS
PLASTICS
POLYAMIDES
POLYMERS
POLYURETHANES
POTTING MATERIALS
REMOVAL
RESINS
SOLVENTS
SYNTHETIC MATERIALS
THERMOPLASTICS