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Silicon implantation into GaAs: Observations of dose rate dependent electrical activation and damage

Journal Article · · Applied Physics Letters; (USA)
DOI:https://doi.org/10.1063/1.103402· OSTI ID:6519402
; ;  [1];  [2]
  1. Naval Research Laboratory, Washington, DC (USA)
  2. Solid State Division, Oak Ridge National Laboratory, Oak Ridge, TN (USA)
The electrical activation of ion-implanted silicon in GaAs has been studied as a function of dose rate (i.e., ion-current density). For a fluence of 10{sup 14} cm{sup {minus}2}, the Hall sheet carrier activation is shown to depend strongly on the dose rate at which the implant was carried out. Carrier concentrations of 7{times}10{sup 18} cm{sup {minus}3} were produced at a 50{times}10{sup {minus}9} A/cm{sup 2} ion-current density. The variation in electrical activation is believed to be the result of a dose rate dependence of the ion-induced damage of GaAs which can be clearly seen in Rutherford backscattering (RBS) channeling measurements of 10{sup 15} cm{sup {minus}2} implants.
DOE Contract Number:
AC05-84OR21400
OSTI ID:
6519402
Journal Information:
Applied Physics Letters; (USA), Journal Name: Applied Physics Letters; (USA) Vol. 57:9; ISSN APPLA; ISSN 0003-6951
Country of Publication:
United States
Language:
English