Microstructure of fine-grained Pb-alloy films for Josephson integrated circuits

Journal Article · Wed Jan 15 04:00:00 EST 1986 · J. Appl. Phys.; (United States)

DOI:https://doi.org/10.1063/1.336665· OSTI ID:6443329

Hasumi, Y; Waho, T

The microstructure of Pb-In-Au alloy films is studied using transmission electron microscopy (TEM), Auger-electron spectroscopy (AES), and x-ray diffraction (XD) in order to obtain fine-grained films for high-reliability Josephson integrated circuits (ICs). TEM and XD observations are made to determine the film structure dependence on deposition technique. The techniques tested are molecular-beam condensation (MBC) and sequential deposition. Furthermore, AES analysis is performed to study the effect of the distribution of AuIn/sub 2/ particles on the film structure. By using the MBC technique, fine-grained films are obtained with average grain sizes of 0.05--0.08 ..mu..m for about 0.2-..mu..m-thick films. This result indicates that the MBC technique is promising for fabrication of high-reliability Pb-alloy Josephson ICs.

• Research Organization: NTT Atsugi Electrical Communication Laboratories, 3-1, Morinosato Wakamiya, Atsugi, Kanagawa 243-01, Japan
• OSTI ID: 6443329
• Journal Information: J. Appl. Phys.; (United States), Journal Name: J. Appl. Phys.; (United States) Vol. 59:2; ISSN JAPIA
• Country of Publication: United States
• Language: English

Related Subjects

420201* -- Engineering-- Cryogenic Equipment & Devices
71 CLASSICAL AND QUANTUM MECHANICS
GENERAL PHYSICS
ALLOYS
AUGER ELECTRON SPECTROSCOPY
COHERENT SCATTERING
CRYSTAL STRUCTURE
DEPOSITION
DIFFRACTION
ELECTRON MICROSCOPY
ELECTRON SPECTROSCOPY
ELECTRONIC CIRCUITS
EPITAXY
FABRICATION
GOLD ALLOYS
GRAIN SIZE
INDIUM ALLOYS
INTEGRATED CIRCUITS
JOSEPHSON JUNCTIONS
JUNCTIONS
LEAD ALLOYS
MICROELECTRONIC CIRCUITS
MICROSCOPY
MICROSTRUCTURE
MOLECULAR BEAM EPITAXY
SCATTERING
SIZE
SPECTROSCOPY
SUPERCONDUCTING JUNCTIONS
TRANSMISSION ELECTRON MICROSCOPY
X-RAY DIFFRACTION