Pb-alloy film preparation technique for Josephson junctions
Journal Article
·
· J. Appl. Phys.; (United States)
A Pb-alloy film preparation technique is proposed and applied to high-reliability Josephson junctions with small threshold current spreads. Fine-grained films with the average grain sizes as small as 30 nm are obtained. This is accomplished by condensing Pb, In, and Au molecular beams onto liquid-nitrogen-cooled substrates. Fine grains result from AuIn/sub 2/ particles being dispersed finely and uniformly in alloy films. Josephson junctions are fabricated using these fine-grained films as base electrodes. The threshold current standard deviation is reduced to 2.4%. This is due to the fine grain size and surface passivation treatment for the base electrodes. The cumulative failure is found to be less than 0.13% after 8400 thermal cycles between 4.2 K and room temperature. This is the best value reported thus far. This technique achieves fine-grained metal alloy films providing new properties. These properties promise to aid development of high-performance Josephson IC's.
- Research Organization:
- Atsugi Electrical Communication Laboratory, Nippon Telegraph and Telephone Public Corporation, Ono, Atsugi, Kanagawa 243-01, Japan
- OSTI ID:
- 6101892
- Journal Information:
- J. Appl. Phys.; (United States), Journal Name: J. Appl. Phys.; (United States) Vol. 57:7; ISSN JAPIA
- Country of Publication:
- United States
- Language:
- English
Similar Records
Thermal stability of Pb-alloy Josephson junction electrode materials. III. Correlation of microstructure and strain in Pb-In-Au base electrodes
Thermal stability of Pb-alloy Josephson junction electrode materials. I. Effects of film thickness and grain size of Pb-In-Au base electrodes
Microstructure of fine-grained Pb-alloy films for Josephson integrated circuits
Journal Article
·
Thu Dec 31 23:00:00 EST 1981
· J. Appl. Phys.; (United States)
·
OSTI ID:5825857
Thermal stability of Pb-alloy Josephson junction electrode materials. I. Effects of film thickness and grain size of Pb-In-Au base electrodes
Journal Article
·
Sat Feb 28 23:00:00 EST 1981
· J. Appl. Phys.; (United States)
·
OSTI ID:6447132
Microstructure of fine-grained Pb-alloy films for Josephson integrated circuits
Journal Article
·
Tue Jan 14 23:00:00 EST 1986
· J. Appl. Phys.; (United States)
·
OSTI ID:6443329
Related Subjects
420201* -- Engineering-- Cryogenic Equipment & Devices
71 CLASSICAL AND QUANTUM MECHANICS
GENERAL PHYSICS
ALLOYS
BEAMS
CRYSTAL STRUCTURE
CURRENTS
DEPOSITION
ELECTRIC CURRENTS
ELECTRODES
ELECTRONIC CIRCUITS
ELEMENTS
EPITAXY
FABRICATION
FAILURES
FILMS
GOLD
GOLD ALLOYS
GRAIN SIZE
INDIUM
INDIUM ALLOYS
INTEGRATED CIRCUITS
JOSEPHSON JUNCTIONS
JUNCTIONS
LEAD
LEAD ALLOYS
METALS
MICROELECTRONIC CIRCUITS
MICROSTRUCTURE
MOLECULAR BEAM EPITAXY
MOLECULAR BEAMS
PARTICLES
PARTICULATES
PASSIVATION
SIZE
SUPERCONDUCTING JUNCTIONS
SURFACE COATING
THIN FILMS
THRESHOLD CURRENT
TRANSITION ELEMENTS
ULTRALOW TEMPERATURE
VACUUM COATING
71 CLASSICAL AND QUANTUM MECHANICS
GENERAL PHYSICS
ALLOYS
BEAMS
CRYSTAL STRUCTURE
CURRENTS
DEPOSITION
ELECTRIC CURRENTS
ELECTRODES
ELECTRONIC CIRCUITS
ELEMENTS
EPITAXY
FABRICATION
FAILURES
FILMS
GOLD
GOLD ALLOYS
GRAIN SIZE
INDIUM
INDIUM ALLOYS
INTEGRATED CIRCUITS
JOSEPHSON JUNCTIONS
JUNCTIONS
LEAD
LEAD ALLOYS
METALS
MICROELECTRONIC CIRCUITS
MICROSTRUCTURE
MOLECULAR BEAM EPITAXY
MOLECULAR BEAMS
PARTICLES
PARTICULATES
PASSIVATION
SIZE
SUPERCONDUCTING JUNCTIONS
SURFACE COATING
THIN FILMS
THRESHOLD CURRENT
TRANSITION ELEMENTS
ULTRALOW TEMPERATURE
VACUUM COATING