Fine-grained Au-Pb-Bi counterelectrodes for lead alloy Josephson junctions

Journal Article · Mon Apr 01 04:00:00 EST 1985 · J. Appl. Phys.; (United States)

DOI:https://doi.org/10.1063/1.335407· OSTI ID:6059346

Suzuki, H; Imamura, T; Hasuo, S

Fine-grained Pb-Bi films with smooth surfaces have been investigated for application to the counterelectrodes of lead alloy Josephson junctions. We have observed that reduced grain size and a smooth surface can be achieved by forming a 2-nm-thick Au seeding layer prior to the deposition of a 400-nm-thick Pb-Bi film. Experimental junctions have been made using Pb-Bi counterelectrodes with the ultrathin Au layer; and their I--V charcteristics have been evaluated. The quality of the junctions has been observed to be slightly reduced; however, they have exhibited excellent initial yield compared to junctions with the conventional Pb-Bi counter electrodes.

• Research Organization: Fujitsu Laboratories Ltd., 1677 Ono, Atsugi 243-01, Japan
• OSTI ID: 6059346
• Journal Information: J. Appl. Phys.; (United States), Journal Name: J. Appl. Phys.; (United States) Vol. 57:7; ISSN JAPIA
• Country of Publication: United States
• Language: English

Related Subjects

420201* -- Engineering-- Cryogenic Equipment & Devices
71 CLASSICAL AND QUANTUM MECHANICS
GENERAL PHYSICS
ALLOYS
BISMUTH ALLOYS
CRYSTAL STRUCTURE
ELECTRIC CONDUCTIVITY
ELECTRICAL PROPERTIES
ELECTRODES
ELEMENTS
FABRICATION
FILMS
GOLD
GOLD ALLOYS
GRAIN SIZE
JOSEPHSON JUNCTIONS
JUNCTIONS
LAYERS
LEAD ALLOYS
METALS
MICROSTRUCTURE
MORPHOLOGY
PHYSICAL PROPERTIES
SIZE
SUPERCONDUCTING JUNCTIONS
SURFACES
THIN FILMS
TRANSITION ELEMENTS