Thermal stability of Pb-alloy Josephson junction electrode materials. IX. Multilayered Pb--In--Au electrodes

Journal Article · Sat Oct 01 04:00:00 EDT 1983 · J. Appl. Phys.; (United States)

DOI:https://doi.org/10.1063/1.331802· OSTI ID:5553832

Murakami, M; Alessandrini, E I; Magerlein, J H

Effects of substrate temperature, deposition sequence, and number of layers on the microstructure of Pb-12 wt. % In-4 wt. % Au films were studied using x-ray diffraction and transmission and scanning electron microscopy before and after repeated thermal cycling between 298 and 4.2 K. Significant grain size reduction and smooth film surfaces were obtained when the film deposition was carried out at substrate temperatures below 200 K. The deposition sequence strongly affected the rate of grain growth that occurred during warming from the deposition temperature to ambient temperature. It was found that the sequential Au and In depositions were essential in order to suppress grain growth. Strain introduced into films upon cooling from 298 to 4.2 K due to a thermal expansion coefficients mismatch between the films and Si substrates was also measured. The strain supported elastically by 0.35-..mu..m-thick multilayered films was increased by reducing the thickness of each layer. By studying dependence of thickness of each layer on strain at 4.2 K, the critical grain size, smaller than which strain is not relaxed by dislocation glide, was determined to be approx.90 nm. This size agrees well with the previously measured mean spacing between misfit dislocations. Based on the present study, 10-layered Pb-In-Au films prepared at 200 K were developed for use as Josephson junction electrodes. The films had smooth surfaces and showed no undercut at the edges of lift-off patterned films. After 400 thermal cycles between 298 and 4.2 K, no microstructure changes such as hillock formation, dislocation slip steps, and grain rotation, were observed. These films can be used both as base electrode films for Pb-alloy Josephson junctions and as counterelectrodes for Nb/Pb-alloy junctions.

• Research Organization: IBM Thomas J. Watson Research Center, Yorktown Heights, New York 10598
• OSTI ID: 5553832
• Journal Information: J. Appl. Phys.; (United States), Journal Name: J. Appl. Phys.; (United States) Vol. 54:10; ISSN JAPIA
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360101 -- Metals & Alloys-- Preparation & Fabrication
360103 -- Metals & Alloys-- Mechanical Properties
420201* -- Engineering-- Cryogenic Equipment & Devices
71 CLASSICAL AND QUANTUM MECHANICS
GENERAL PHYSICS
ALLOYS
COATINGS
COHERENT SCATTERING
CRYSTAL STRUCTURE
DEPOSITION
DIFFRACTION
ELECTRODES
ELECTRON MICROSCOPY
ELEMENTS
FABRICATION
FILMS
GOLD ALLOYS
GRAIN GROWTH
GRAIN SIZE
INDIUM ALLOYS
JOSEPHSON JUNCTIONS
JUNCTIONS
LAYERS
LEAD ALLOYS
LOW TEMPERATURE
MEDIUM TEMPERATURE
MICROSCOPY
MICROSTRUCTURE
SCANNING ELECTRON MICROSCOPY
SCATTERING
SEMIMETALS
SILICON
SIZE
STABILITY
STRAINS
SUPERCONDUCTING JUNCTIONS
SURFACE COATING
TEMPERATURE EFFECTS
TRANSMISSION ELECTRON MICROSCOPY
ULTRALOW TEMPERATURE
VACUUM COATING
VAPOR DEPOSITED COATINGS
VERY LOW TEMPERATURE
X-RAY DIFFRACTION