Use of indium solder to patch leaks in silver-solder joints on cryostats

Journal Article · Thu Jan 31 23:00:00 EST 1985 · Rev. Sci. Instrum.; (United States)

DOI:https://doi.org/10.1063/1.1138353· OSTI ID:6363142

Holtz, R L; Swenson, C A

Indium metal as a solder can provide a convenient and effective, last resort, patching material for leaks which occur spontaneously in metallic low-temperature apparatus. Indium bonds well to many metals and, more importantly, remains ductile to 4 K. An indium patch therefore retains its integrity even where a leak has occurred due to the differential thermal expansions of construction materials.

• Research Organization: Ames Laboratory--USDOE and Department of Physics, Iowa State University, Ames, Iowa 50011
• DOE Contract Number: W-7405-ENG-82
• OSTI ID: 6363142
• Journal Information: Rev. Sci. Instrum.; (United States), Journal Name: Rev. Sci. Instrum.; (United States) Vol. 56:2; ISSN RSINA
• Country of Publication: United States
• Language: English

Related Subjects

420201* -- Engineering-- Cryogenic Equipment & Devices
71 CLASSICAL AND QUANTUM MECHANICS
GENERAL PHYSICS
CONTROL EQUIPMENT
CRYOSTATS
ELEMENTS
EQUIPMENT
FABRICATION
INDIUM
JOINING
JOINTS
LEAKS
METALS
SOLDERED JOINTS
SOLDERING
THERMOSTATS
ULTRALOW TEMPERATURE
USES
WELDING