Computational Modeling Demonstrates the Joint Clearance Effect on the Tensile Strength of Solder Joints.
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Soldered joints can be made with a wide range of base materials and filler metals that allow the assembly to meet its performance and reliability requirements. Structural solder joints have, as their foremost requirement, to provide mechanical attachment between base material structures. The joint is typically subjected to one, or a combination of, three loading configurations: (a) tensile or compressive force, (b) shear force, or (c) peel force. Solder filler metals and in particular, the so-called “soft solders” based on tin (Sn), lead (Pb), and indium (In), generally have a bulk strength that is less than that of the base materials. Finally, deformation occurs largely in the solder when the joint is subjected to an applied force.
- Research Organization:
- Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE National Nuclear Security Administration (NNSA)
- Grant/Contract Number:
- NA0003525
- OSTI ID:
- 1831167
- Report Number(s):
- SAND--2021-9149J; 697562
- Journal Information:
- Welding Journal, Journal Name: Welding Journal Journal Issue: 9 Vol. 100; ISSN 0043-2296
- Publisher:
- American Welding SocietyCopyright Statement
- Country of Publication:
- United States
- Language:
- English
Similar Records
Understanding the Reliability of Solder Joints Used in Advanced Structural and Electronics Applications: Part 2 - Reliability Performance.
Aging of gold thick-film solder joints. Final report