Aging of gold thick-film solder joints. Final report
Temperature aging effects on 90-degree peel strength and metallization lift-off were determined for soldered gold thick-film connections. Those effects to the 90-degree peel strength and the time at temperature resulting in metallization lift-off were determined. Six indium- or tin-based solder alloys were investigated. The study was performed at room temperature, 50 and 90% of the alloy melting point (or solidus) temperature through 500 h of aging. Sn63 alloy produced the highest peel strength soldered connections of the alloys evaluated, but the alloy consumed the greatest amount of gold in forming intermetallic compounds. Further, metallographic sampling was performed to inspect intermetallic formation between the gold and the tin or indium constitutents.
- Research Organization:
- Bendix Corp., Kansas City, MO (USA)
- DOE Contract Number:
- AC04-76DP00613
- OSTI ID:
- 5826789
- Report Number(s):
- BDX-613-3234; ON: DE85009847
- Country of Publication:
- United States
- Language:
- English
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