Effects of rework on adhesion of Pb-In soldered gold thick films

Conference · Mon Feb 01 04:00:00 EST 1982

OSTI ID:5187290

Gehman, R W; Becka, G A; Losure, J A

The feasibility of repeatedly reworking Pb-In soldered joints on gold thick films was evaluated. Nailhead adhesion tests on soldered thick films typically resulted in failure within the bulk solder (50 In-50 Pb). Average strengths increased with each rework, and the failure mode changed. An increase in metalization lift-off occurred with successive reworks. An investigation was initiated to determine why these changes occurred. Based on this work, the thick film adhesion to the substrate appeared to be lowered by indium reduction of cadmium oxide and by formation of a weak, brittle intermetallic compound, Au/sub 9/In/sub 4/. It was concluded that two solder reworks could be conducted without significant amounts of metallization lift-off during nailhead testing.

• Research Organization: Bendix Corp., Kansas City, MO (USA)
• DOE Contract Number: AC04-76DP00613
• OSTI ID: 5187290
• Report Number(s): BDX-613-2714; CONF-820521-3; ON: DE82015428
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
420800* -- Engineering-- Electronic Circuits & Devices-- (-1989)
ADHESION
ALLOYS
ALUMINIUM COMPOUNDS
ALUMINIUM OXIDES
CADMIUM COMPOUNDS
CADMIUM OXIDES
CHALCOGENIDES
CHEMICAL ANALYSIS
ELECTRON MICROPROBE ANALYSIS
ELECTRONIC CIRCUITS
ELEMENTS
FABRICATION
FAILURES
FILMS
GOLD
INDIUM ALLOYS
INTERMETALLIC COMPOUNDS
JOINTS
LEAD ALLOYS
METALS
MICROANALYSIS
MICROELECTRONIC CIRCUITS
OXIDES
OXYGEN COMPOUNDS
PRINTED CIRCUITS
SOLDERED JOINTS
SUBSTRATES
TRANSITION ELEMENTS