Gold plating for hybrid microcircuits

Conference · Sat Apr 01 04:00:00 EST 1978

OSTI ID:6350489

Dini, J W; Johnson, H R

Electrochemical porosity tests and Auger electron spectroscopy were used to evaluate three gold electroplating formulations (citrate, phosphonic acid, and phosphate) at varying current densities, deposition modes (ad, dc, and pulse), and thicknesses for eventual use on hybrid microcircuits. Electroplated films were shown to be less porous than evaporated or sputtered films by at least an order of magnitude. Plating current densities of 75.6 A/m/sup 2/ produced deposits more porous than those obtained at 10.8 and 32.4 A/m/sup 2/. Direct current or pulse-plated deposits were typically less porous than ac deposits. Auger electron spectroscopy showed more chromium to be present on the surface of evaporated than on electroplated gold-coated hybrid microcircuits after heating at 300/sup 0/C for two hours. In the amount of chromium which diffused through the films, a comparison of the various methods of electrodeposition showed very little difference.

• Research Organization: Sandia Labs., Albuquerque, NM (USA)
• DOE Contract Number: EY-76-C-04-0789
• OSTI ID: 6350489
• Report Number(s): SAND-77-8047; CONF-790103-2
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360101* -- Metals & Alloys-- Preparation & Fabrication
ADHESION
ALUMINIUM COMPOUNDS
ALUMINIUM OXIDES
CARBOXYLIC ACID SALTS
CHALCOGENIDES
CHEMICAL REACTIONS
CHROMIUM
CITRATES
COPPER
CORROSION
CRYSTAL STRUCTURE
DEPOSITION
DIFFUSION
ELECTRIC CONDUCTORS
ELECTRODEPOSITION
ELECTROLYSIS
ELECTROPLATING
ELEMENTS
EVAPORATION
GOLD
GRAIN SIZE
LYSIS
METALS
MICROSTRUCTURE
NITRIDES
NITROGEN COMPOUNDS
ORGANIC ACIDS
ORGANIC COMPOUNDS
ORGANIC PHOSPHORUS COMPOUNDS
OXIDES
OXYGEN COMPOUNDS
PHASE TRANSFORMATIONS
PHOSPHATES
PHOSPHONIC ACIDS
PHOSPHORUS COMPOUNDS
PLATING
PNICTIDES
POROSITY
SIZE
SURFACE COATING
TANTALUM COMPOUNDS
TANTALUM NITRIDES
TRANSITION ELEMENT COMPOUNDS
TRANSITION ELEMENTS