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A structural and electrical comparison of BCl and BF/sub 2/ ion-implanted silicon

Journal Article · · J. Electrochem. Soc.; (United States)
DOI:https://doi.org/10.1149/1.2113860· OSTI ID:6342754
The molecular ions BCl/sup +/ and BF/sub 2//sup +/ are implanted into <100> silicon at an energy of 16 keV per boron atom in the dose range of 6 X 10/sup 14/-1.2 X 10/sup 15/ cm/sup -2/ to form shallow p/sup +//n junctions. Cross-sectional transmission electron microscopy shows that chlorine is at least four times as effective as fluorine in amorphizing silicon. The increase in thickness of the amorphous layer, however, has a small effect in the reduction of axial channeling of boron as measured by secondary ion mass spectrometry. After annealing for 30 min at 900/sup 0/C, diffusion of interstitial boron is enhanced by chlorine relative to fluorine, whereas the electrical activity of boron is inhibited. Diodes made with both BCl/sup +/ and BF/sub 2//sup +/ implantations have comparable I-V characteristics with low reverse-bias junction leakage currents that are not affected by a band of dislocation loops which remain near the original amorphous-crystalline interface.
Research Organization:
Philips Research Laboratories, Signetics Corporation, Sunnyvale, California
OSTI ID:
6342754
Journal Information:
J. Electrochem. Soc.; (United States), Journal Name: J. Electrochem. Soc.; (United States) Vol. 132:2; ISSN JESOA
Country of Publication:
United States
Language:
English