Deposition of aluminum--copper alloy on laminated polyimide substrates from a RF induction source

Conference · Sun Apr 01 04:00:00 EST 1979

OSTI ID:6266367

Hale, G J

A physical vapor deposition process with a rf induction vapor source has been developed to deposit 11.2-..mu..m Al--Cu alloy on polyimide laminate substrates. The average thickness uniformity (standard deviation/average thickness) of the deposit acquired by a beta backscatter technique was approximately 1% for these deposits. The Al-0.3 wt % Cu vapor charge results in a Cu content in the deposit of 0.12 wt %. The Cu shows no preferential deposition pattern, as related to the surface of the laminate and its dispersion throughout the deposit. The resistivity of the Al--Cu deposits is 3.0 ..mu cap omega..-cm and is stable from one deposition run to another. Also, the resistivity was not related to the geometry of the domed substrate. The density of the 11.2-..mu..m-thick Al--Cu film was within 1% of theoretical, and its adhesion to the polyimide exceeds that required for post-deposition operations and handling. The deposited films exhibited a specular reflectance above 90% with a 632.8 nm wave length source and a grain size of 0.6 ..mu..m throughout the deposit.

• Research Organization: Bendix Corp., Kansas City, MO (USA)
• DOE Contract Number: EY-76-C-04-0613
• OSTI ID: 6266367
• Report Number(s): BDX-613-2173; CONF-790442-6
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
420800* -- Engineering-- Electronic Circuits & Devices-- (-1989)
ALLOYS
ALUMINIUM ALLOYS
ALUMINIUM BASE ALLOYS
COATINGS
COPPER ALLOYS
DEPOSITION
ELECTRONIC CIRCUITS
FABRICATION
FLUIDS
GASES
INTEGRATED CIRCUITS
MICROELECTRONIC CIRCUITS
PETROCHEMICALS
PETROLEUM PRODUCTS
PLASTICS
SUBSTRATES
VAPOR DEPOSITED COATINGS
VAPORS