Deposition of aluminum-copper alloy on laminated polyimide substrates from an RF induction source
A physical vapor deposition process with an rf induction vapor source has been developed to deposit 11.2-..mu..m aluminum-copper alloy on polyimide laminate substrates. The total thickness values can be repeated within a /sup + -/0.5-..mu..m range with a 90-percent yield. The average thickness uniformity (standard deviation divided by average thickness) of the deposit acquired by beta backscatter for 100 substrates was 1.2 percent. The aluminum-0.3 weight percent copper vapor charge results in a copper content in the deposit of approximately 0.12 weight percent. The copper shows no preferential deposition pattern, as related to the surface of the laminate and its dispersion throughout the deposit. The resistivity of the aluminum-copper deposits is 3 ..mu cap omega..-cm and is stable from one deposition run to another. Also, the resistivity did not appear to be related to the geometry of the domed substrate. The density of the 11.2-..mu..m-thick aluminum-copper film was within 1 percent of theoretical, and its adhesion to the polyimide exceeds that required for postdeposition operations and handling. Physical vapor-deposited aluminum-copper films for beta backscatter thickness standards were provided and were instrumental in achieving the reported uniformity values and determining the beta backscatter measurement uncertainty.
- Research Organization:
- Bendix Corp., Kansas City, MO (USA)
- DOE Contract Number:
- EY-76-C-04-0613
- OSTI ID:
- 6519028
- Report Number(s):
- BDX-613-1993(Rev.)
- Country of Publication:
- United States
- Language:
- English
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