Uniform aluminum deposits on large nonplanar and planar polyimide substrates by physical vapor deposition

Technical Report · Tue Jul 01 04:00:00 EDT 1980

DOI:https://doi.org/10.2172/5185473· OSTI ID:5185473

Hale, G. J.

The capability to deposit 10- to 12-..mu..m-thick aluminum films with less than 2 percent thickness uniformity (defined as standard deviation/average thickness) on large nonplanar and planar polyimide substrates has been developed using physical vapor deposition (PVD). A technique called shadow masking was developed to provide this consistent deposit uniformity over the entire substrate surfaces (greater than 2000 cm/sup 2/). The specific dimensions of a shadow mask for each substrate are generated from a computer-reduced plot of beta-backscatter thickness measurements of a previous deposit. With this developed method, initial thickness uniformities of 9.7 and 24.7 percent obtained for the nonplanar and planar deposits were improved to 1.07 and 1.80 percent, respectively.

• Research Organization: Bendix Corp., Kansas City, MO (USA)
• DOE Contract Number: AC04-76DP00613
• OSTI ID: 5185473
• Report Number(s): BDX-613-2397
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360101* -- Metals & Alloys-- Preparation & Fabrication
360104 -- Metals & Alloys-- Physical Properties
ALUMINIUM
COATINGS
DEPOSITION
DIMENSIONS
ELEMENTS
FILMS
IMIDES
METALS
ORGANIC COMPOUNDS
ORGANIC NITROGEN COMPOUNDS
ORGANIC POLYMERS
POLYMERS
SURFACE COATING
THICKNESS
VAPOR DEPOSITED COATINGS