Adhesion of polyimides to aluminum substrates
Conference
·
OSTI ID:441519
- Univ. of Cincinnati, OH (United States)
Numerous investigations have been reported of thin films formed by spin-coating the polyamic acid of PMDA/ODA onto metal surfaces and heat-treating the films to obtain the polyimide. Several reports have also appeared in which solventless polyimide films formed by vapor co-deposition of PMDA and ODA onto metallic and semiconductor substrates have been described. Considerable progress has been made in determining the structure of films formed by polyamic acids which are spin-coated onto metal substrates and thermally imidized. However, many key questions remain, particularly regarding the effect of processing variables on the molecular structure and properties of polyimide films. The goal of this investigation was to relate the interfacial fracture energy of polyimide films deposited onto aluminum substrates to the molecular structure of the films.
- OSTI ID:
- 441519
- Report Number(s):
- CONF-960214--
- Country of Publication:
- United States
- Language:
- English
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