Diffusion of water in photosensitive polyimide thin films
- IBM Technology Products, Hopewell Junction, NY (United States)
- Columbia Univ., New York, NY (United States)
Using stress relaxation analysis and gravimetry, the water uptake behavior of several high temperature polyimide thin films imidized from polyamic acids and their PSPI precursors was investigated: PMDA-PDA, PMDA-ODA, BPDA-PDA, BPDA-ODA, and BTDA-ODA. The diffusion of water in all the polyimides followed Fick`s second law, regardless of backbone chemistry and polyimide precursor origin. However, the water uptake behavior was primarily dependent upon the morphological structure as well as the backbone chemistry (i.e., chemical affinity to water). This further depends on the polyimide precursor origin, voids, and residues. Overall, the water uptake and diffusion coefficient in the polyimides prepared from the PSPI precursors was high due to the morphological changes, voids, and residues generated by the photoactive groups and photopackage components being outgassed during thermal imidization in comparison with those of the corresponding polyimides from the respective conventional poly(amic acid) precursors. The water uptake behaviors will be correlated to absorbed water related reliability issues in microelectronic devices, such as metal corrosion and degradation of physical properties.
- OSTI ID:
- 141877
- Report Number(s):
- CONF-930304--
- Country of Publication:
- United States
- Language:
- English
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