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X-ray scattering studies of polyimide thin films from poly(amic acid)s functionalized with a methacrylate

Conference ·
OSTI ID:5700554
;  [1];  [2]
  1. International Business Machines Corp., Hopewell Junction, NY (United States)
  2. Oak Ridge National Lab., TN (United States)

Using the techniques of wide-angle x-ray diffraction (WAXD) and small-angle x-ray scattering (SAXS), the morphology of several polyimide thin films prepared by thermal imidization of the photosensitive polyimide precursors has been investigated and compared with that of the corresponding polyimide films thermally prepared from the non-photosensitive poly(amic acid) precursors in order to examine the morphological changes due to thermally leaving photosensitive groups linked to the precursors: PMDA-ODA, BPDA-PDA and BTDA-ODA. In addition, the morphology of Pimel G-6246A photosensitive polyimide film with its unknown chemical structure has been studied. The WAXD results indicate that the BTDA-ODA polyimide is amorphous, whereas the other polyimides exhibit a molecular order (i.e., chain order or packing order). Molecular chain order was enhanced in the PMDA-ODA by the photosensitive groups, but was disturbed in the BPDA-PDA by them. In particular, the packing order in the BPDA-PDA was improved by the photosensitive groups. In Lorentz-corrected SAXS analyses, a long period (130--160 {Angstrom} mean periodicity) was observed for all the polyimides except the PMDA-ODA. The micro-structure could be described by an extended chain based two-phase (ordered and less ordered phase) model with diffuse boundaries. In addition, the Guinier SAXS analyses indicate the presence of two different size voids in all the polyimide films, regardless of the precursor origin: 251--349 {Angstrom} and 25--54 {Angstrom} in radius, depending upon the type of polyimide.

Research Organization:
Oak Ridge National Lab., TN (United States)
Sponsoring Organization:
DOE; USDOE, Washington, DC (United States)
DOE Contract Number:
AC05-84OR21400
OSTI ID:
5700554
Report Number(s):
CONF-9110352-1; ON: DE92010120
Country of Publication:
United States
Language:
English