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Tailoring the microstructure of polyimide-silica materials using the sol-gel process

Book ·
OSTI ID:427696
Polyimide-silica materials have been prepared via the sol-gel process by mixing tetramethoxysilane with a polyamic acid. Two polyamic acids have been used. The first is obtained with an equimolar mixture of oxydianiline (ODA) and pyromellitic dianhydride (PMDA) in dimethyacetamide. The second is prepared with a mixture of PMDA with aminopropyltrimethoxysilane (APrTMOS). The microstructure of the materials obtained with these two polyamic acids are drastically different. The presence of both amino and methoxy side-groups on the APrTMOS enables a chemical bonding between the organic and the inorganic networks resulting in the formation of homogeneous films. On the other side, no chemical bond is provided by the ODA-PMDA polyamic acid resulting in a biphasic microstructure where pure silica particles are embedded in a polyimide matrix. These two types of materials have been characterized in order to point out the key parameters of their microstructure. {sup 29}Si NMR, thermogravimetric analysis, scanning electron microscopy and infra-red spectroscopy have been used to study materials containing various proportions of TMOS and prepared with various hydrolysis ratios.
OSTI ID:
427696
Report Number(s):
CONF-960401--; ISBN 1-55899-338-X
Country of Publication:
United States
Language:
English

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