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Title: Solidification of highly undercooled liquid silicon produced by pulsed laser melting of ion-implanted amorphous silicon: Time-resolved and microstructural studies

Journal Article · · J. Mat. Res.; (United States)

Nanosecond resolution time-resolved visible (632.8 nm) and infrared (1152 nm) reflectivity measurements, together with structural and Z-contrast transmission electron microscope (TEM) imaging, have been used to study pulsed laser melting and subsequent solidification of thick (190--410 nm) amorphous (a) Si layers produced by ion implantation. Melting was initiated using a KrF (248 nm) excimer laser of relatively long (45 ns full width half maximum (FWHM)) pulse duration; the microstructural and time-resolved measurements cover the entire energy density (E/sub l/) range from the onset of melting (at approx. >0.12 J/cm/sup 2/) up to the onset of epitaxial regrowth (at --1.1 J/cm/sup 2/). At low E/sub l/ the infrared reflectivity measurements were used to determine the time of formation, the velocity, and the final depth of ''explosively'' propagating buried liquid layers in 410 nm thick a-Si specimens that had been uniformly implanted with Si, Ge, or Cu over their upper --300 nm. Measured velocities lie in the 8--14 m/s range, with generally higher velocities obtained for the Ge- and Cu-implanted ''a-Si alloys.'' The velocity measurements result in an upper limit of 17 ( +- 3) K on the undercooling versus velocity relationship for an undercooled solidfying liquid--crystalline Si interface. The Z-contrast scanning TEM measurements of the final buried layer depth were in excellent agreement with the optical measurements.

Research Organization:
Solid State Division, Oak Ridge National Laboratory, Oak Ridge, Tennessee 37831
DOE Contract Number:
AC05-84OR21400
OSTI ID:
6254259
Journal Information:
J. Mat. Res.; (United States), Vol. 2:5
Country of Publication:
United States
Language:
English