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Electronic properties of sol-gel-derived oxides on silicon

Journal Article · · Appl. Phys. Lett.; (United States)
DOI:https://doi.org/10.1063/1.98725· OSTI ID:6038907
Sol-gel-derived SiO/sub 2/, borosilicate, and aluminosilicate thin films deposited on silicon and heated for 5 min at temperatures of 1000 /sup 0/C or lower exhibit dielectric strength as great as 5 MV/cm and interface state densities as low as --1 x 10/sup 11//cm/sup 2/ eV. These values represent significant improvements over previous sol-gel-derived oxides on semiconductors and indicate that sol-gel processing can provide device quality oxides in situations where native oxides are unavailable or exhibit poor dielectric behavior, e.g., amorphous, hydrogenated silicon or III-V compound semiconductors.
Research Organization:
Department of Engineering Science and Mechanics, The Pennsylvania State University, University Park, Pennsylvania 16802
OSTI ID:
6038907
Journal Information:
Appl. Phys. Lett.; (United States), Journal Name: Appl. Phys. Lett.; (United States) Vol. 51:15; ISSN APPLA
Country of Publication:
United States
Language:
English