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Effect of Substrate Composition on the Piezoelectric Response of Reactively Sputtered AlN Thin Films

Journal Article · · Thin Solid Films
OSTI ID:5904

Deposition parameters were found to have a marked effect on piezoelectric response of reactive radio frequency (RF) sputtered AlN thin films. The authors observed peizoelectric response values ranging from {minus}3.5 to +4.2 pm/V for 1 {micro}m thick AlN films deposited onto Ti/Ru electrode stacks. An investigation of the effects of deposition parameters, in particular the nature of the Ru/AlN interface, was conducted. The lag time between deposition of adjacent thin film layers appeared to have the greatest affect on the value of the piezoelectric response. This suggests that chemical reaction occurring on the Ru thin film surface is responsible for changing an important thin film property such as dipole orientation within the overlying AlN thin film.

Research Organization:
Sandia National Labs., Albuquerque, NM (US); Sandia National Labs., Livermore, CA (US)
Sponsoring Organization:
US Department of Energy (US)
DOE Contract Number:
AC04-94AL85000
OSTI ID:
5904
Report Number(s):
SAND99-0994J
Journal Information:
Thin Solid Films, Journal Name: Thin Solid Films
Country of Publication:
United States
Language:
English

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