Skip to main content
U.S. Department of Energy
Office of Scientific and Technical Information

Carbon in GaAs: Implantation and isolation characteristics

Journal Article · · Appl. Phys. Lett.; (United States)
DOI:https://doi.org/10.1063/1.101820· OSTI ID:5832445

Carbon was implanted into GaAs at doses between 10/sup 13/ and 5/times/10/sup 14/ cm/sup /minus/2/, either by itself or with Ga coimplantation at room temperature or 200 /degree/C. Activation percentages as high as 40% were obtained for C+Ga implants at 5/times/10/sup 14/ cm/sup /minus/2/ compared to /lt/3% for C implantation only. The peak activation occurs for an annealing temperature of 800 /degree/C for 10 s, while above this the net activation decreases, apparently due to site switching. The C shows fairly minimal redistribution during anneals up to 1000 /degree/C in contrast to other acceptor dopants in GaAs. The formation of highly resistive (/gt/10/sup 6/ /Omega//(spec. char. missing)) layers in C-doped (/ital p//similar to/2/times/10/sup 20/ cm/sup /minus/3/) GaAs is possible by using oxygen bombardment doses above 5/times/10/sup 14/ cm/sup /minus/2/. Under these conditions the evolution of the implanted layer resistivity with annealing temperature can be described by the usual trap-related compensation mechanism.

Research Organization:
AT T Bell Laboratories, Murray Hill, New Jersey 07974 (US)
OSTI ID:
5832445
Journal Information:
Appl. Phys. Lett.; (United States), Journal Name: Appl. Phys. Lett.; (United States) Vol. 55:7; ISSN APPLA
Country of Publication:
United States
Language:
English