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Thermally stable oxygen implant isolation of [ital p]-type Al[sub 0. 2]Ga[sub 0. 8]As

Journal Article · · Applied Physics Letters; (United States)
DOI:https://doi.org/10.1063/1.109288· OSTI ID:6784806
; ;  [1]
  1. Sandia National Laboratories, Albuquerque, New Mexico 87185-5800 (United States)
High dose oxygen implantation was used to form high resistivity regions in [ital p]-type Al[sub 0.2]Ga[sub 0.8]As. By achieving oxygen concentrations 30 times the grown-in beryllium concentration we created Al[sub 0.2]Ga[sub 0.8]As layers with a sheet resistance of over 10[sup 10] [Omega]/(spec. char. missing) that were stable to 900 [degree]C. Samples implanted with a base dose of 2[times]10[sup 14] cm[sup [minus]2] showed an apparent activation energy for conduction of 0.67 eV after annealing at 800 [degree]C.
DOE Contract Number:
AC04-76DP00789
OSTI ID:
6784806
Journal Information:
Applied Physics Letters; (United States), Journal Name: Applied Physics Letters; (United States) Vol. 62:20; ISSN APPLAB; ISSN 0003-6951
Country of Publication:
United States
Language:
English