Thermally induced failures of thick-film glaze resistors
Thick-film glaze resistors are particularly attractive for use in environments subject to extreme changes in temperature because of their low TCR values. Recently, however, it has been shown these resistors may fail when they are subjected to extended temperature cycling. The failures are characterized by increasing resistance with cycling and may ultimately culminate in a completely open condition. Examination of the failed components using a scanning electron microscope revealed the presence of cracks in the resistive glaze. The microstructural origin and propagation of these cracks are discussed in terms of an elastic model, and solutions to the problem of thermal cycling failure are proposed.
- Research Organization:
- Allied Corp., Kansas City, MO (USA). Bendix Kansas City Div.
- DOE Contract Number:
- AC04-76DP00613
- OSTI ID:
- 5736715
- Report Number(s):
- BDX-613-3230; CONF-850599-2; ON: DE85012014
- Country of Publication:
- United States
- Language:
- English
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