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Chemical perspectives of microelectronic materials. 2

Conference ·
OSTI ID:5639394
 [1];  [2]; ;  [3]
  1. Rensselaer Polytechnic Inst., Troy, NY (United States)
  2. Massachusetts Inst. of Tech., Cambridge, MA (United States)
  3. AT and T Bell Labs., Murray Hill, NJ (United States)

The organization of this volume reflects that of the symposium itself with groupings by materials, rather than by techniques. Thus, we start off with a section on GaAs surface chemistry that includes surface chemistry relevant to the deposition of GaAs, as well as chemistry related to etching processes. This is followed by a section on precursors for compound semiconductor MOCVD which highlights recent research on wide range of organometallic systems designed for use in III-V, IV-IV, and II-VI deposition processes. The third section centers on chemical and chemical processing-related issues involved in compound semiconductor growth and etching, including studies of impurity incorporation and doping and the modeling of the CVD and PECVD reactor environments. The deposition and surface chemistry of silicon is the main subject of the fourth section. The final two sections cover the chemistry of new precursors designed for use in the deposition of a variety of other materials used in microelectronics processing, with metals, oxides and nitrides being the particular focus of attention.

OSTI ID:
5639394
Report Number(s):
CONF-901105--; ISBN: 1-55899-096-8
Country of Publication:
United States
Language:
English