Niobium-stress influence on Nb/Al-oxide/Nb Josephson junctions

Journal Article · Fri Apr 01 04:00:00 EST 1988 · J. Appl. Phys.; (United States)

DOI:https://doi.org/10.1063/1.341051· OSTI ID:5485352

Kuroda, K; Yuda, M

Niobium-stress influence on Nb/Al-oxide/Nb trilayer Josephson-junction characteristics is studied. Different junction fabrication techniques are examined such as conventional etching and new lift-off processes. Nb-film stress, relaxed during trilayer etching, can deteriorate junction quality in etching-processed junctions smaller than a few micrometers square. Such deterioration does not occur in lift-off processed junctions even when they are 1 ..mu..m square because stress relaxation occurs during trilayer deposition through lift-off stencils. This new all-Nb Josephson-junction fabrication technique produces high-quality junctions with R/sub s//sub g//R/sub n//sub n/ = 24 (R/sub s//sub g/ and R/sub n//sub n/ are tunnel resistances at 2 and 4 mV, respectively) and a current uniformity of 1.5% for 100 1-..mu..m-square junctions connected in series.

• Research Organization: NTT LSI Laboratories, Morinosato Wakamiya 3-1, Atsugi-shi, Kanagawa, 243-01, Japan
• OSTI ID: 5485352
• Journal Information: J. Appl. Phys.; (United States), Journal Name: J. Appl. Phys.; (United States) Vol. 63:7; ISSN JAPIA
• Country of Publication: United States
• Language: English

Related Subjects

420201* -- Engineering-- Cryogenic Equipment & Devices
71 CLASSICAL AND QUANTUM MECHANICS
GENERAL PHYSICS
ELECTRICAL PROPERTIES
ELEMENTS
ETCHING
FABRICATION
JOSEPHSON JUNCTIONS
JUNCTIONS
METALS
NIOBIUM
PHYSICAL PROPERTIES
STRESSES
SUPERCONDUCTING JUNCTIONS
SURFACE FINISHING
TRANSITION ELEMENTS