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Sub-. mu. m, planarized, Nb-AlO sub x -Nb Josephson process for 125 mm wafers developed in partnership with Si technology

Journal Article · · Applied Physics Letters; (United States)
DOI:https://doi.org/10.1063/1.106405· OSTI ID:5150194
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  1. IBM Research Division, T. J. Watson Research Center, Yorktown Heights, New York (USA)
  2. Lincoln Laboratory, Massachusetts Institute of Technology, Lexington, Massachusetts (USA)
We have demonstrated a new planarized all-refractory technology for low {ital T}{sub {ital c}} superconductivity (PARTS). With the exception of the Nb-AlO{sub {ital x}}-Nb trilayer preparation, the processing is done almost exclusively within an advanced Si technology fabrication facility. This approach has allowed us to leverage highly off of existing state-of-the-art lithography, metal etching, materials deposition, and planarization capabilities. Using chemical-mechanical polish as the planarization technique we have fabricated Josephson junctions ranging in size from 0.5--100 {mu}m{sup 2}. Junction quality is excellent with the figure of merit {ital V}{sub {ital m}} typically exceeding 70 mV. PARTS has yielded fully functional integrated Josephson devices including magnetometers, gradiometers, and soliton oscillators.
OSTI ID:
5150194
Journal Information:
Applied Physics Letters; (United States), Journal Name: Applied Physics Letters; (United States) Vol. 59:20; ISSN APPLA; ISSN 0003-6951
Country of Publication:
United States
Language:
English