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U.S. Department of Energy
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Passivation of grain boundaries in silicon

Journal Article · · J. Vac. Sci. Technol.; (United States)
DOI:https://doi.org/10.1116/1.571326· OSTI ID:5483463

Several papers have demonstrated that the introduction of hydrogen into polycrystalline silicon can remove grain boundary trapping states. Evidence for this comes from studies of both majority carrier transport over grain boundary potential barriers and minority carrier recombination at these defects. Data on hydrogen passivation will be reviewed and the relative utility of both these transport measurements will be discussed with regard to the optimization of this process. Recent studies utilizing a Kaufman ion source have shown that increasing the proton energies and the dose rate greatly facilitates passivation in silicon. Simple diffusion models will be presented which account for these observations. This new treatment method has reduced the time necessary to improve photovoltaic cell parameters to the domain of commercial feasibility; the prospects for further improvements will be assessed. Because this passivation technique is essentially a low energy implantation process, there are accompanying damage and sputtering effects: methods for the control of these will be suggested.

Research Organization:
Sandia National Laboratories, Albuquerque, New Mexico 87185
DOE Contract Number:
AC04-76DP00789
OSTI ID:
5483463
Journal Information:
J. Vac. Sci. Technol.; (United States), Journal Name: J. Vac. Sci. Technol.; (United States) Vol. 20:3; ISSN JVSTA
Country of Publication:
United States
Language:
English