Polystyrene-bead foam for electronic packages
Two different types of materials were considered as candidates for removable encapsulants; one was a thermoplastic polyurethane foam. Experimental work had shown this type of polyurethane foam could be formulated with all of the desired properties except temperature resistance. Work is continuing on the development of a solvent-removable polyurethane foam with higher temperature capability. The second material considered was polystyrene bead foam (PSBF), which is easily processed in the required density range and can be removed readily by common solvents. The polystyrene beads can be preexpanded and screened to the desired density in standard preexpansion equipment, and then poured into the free or void space of the unit. The unit is sealed and subjected to a fusion cycle in an oven at 100/sup 0/C. Bendix has undertaken an extensive evaluation of PSBF for this application.
- Research Organization:
- Bendix Corp., Kansas City, MO (USA)
- DOE Contract Number:
- AC04-76DP00613
- OSTI ID:
- 5321221
- Report Number(s):
- BDX-613-2710; CONF-820505-1; ON: DE82010112
- Resource Relation:
- Conference: Society of Plastics Engineers annual technical conference, San Francisco, CA, USA, 10 May 1982; Other Information: Portions of this report are illegible
- Country of Publication:
- United States
- Language:
- English
Similar Records
Evaluation of polystyrene bead foam as an encapsulant for electonic packages. Final report
Determination of fusion cycles for polystyrene bead foam. Final report
Related Subjects
47 OTHER INSTRUMENTATION
ELECTRONIC EQUIPMENT
ENCAPSULATION
PACKAGING
COMPRESSION STRENGTH
TENSILE PROPERTIES
POLYSTYRENE
STRESS ANALYSIS
EQUIPMENT
MATERIALS
MECHANICAL PROPERTIES
ORGANIC COMPOUNDS
ORGANIC POLYMERS
PETROCHEMICALS
PETROLEUM PRODUCTS
PLASTICS
POLYMERS
POLYOLEFINS
POLYVINYLS
SYNTHETIC MATERIALS
360403* - Materials- Polymers & Plastics- Mechanical Properties- (-1987)
440300 - Miscellaneous Instruments- (-1989)