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Ion implantation doping of OMCVD grown GaN

Journal Article · · Journal of Electronic Materials
;  [1]; ;  [2];  [3];  [4]
  1. George Mason Univ., Fairfax, VA (United States)
  2. Naval Research Lab., Washington, DC (United States)
  3. Oak Ridge National Lab., TN (United States)
  4. National Inst. of Standards and Technology, Gaithersburg, MD (United States)
Doping by ion implantation using Si, O, Mg, and Ca has been studied in single crystal semi-insulation and n-type GaN grown on {alpha}-sapphire substrates. The n- and p-type dopants used in this study are Si and O; Mg and Ca, respectively. Room temperature activation of Si and O donors has been achieved after 1150{degree}C annealing for 120 s. The activation of Mg and Ca acceptors is too low to measure at both room temperature and 300{degree}C. Using higher doses to achieve a measurable p-type conduction increases the amount of damage created by the implantation. Rutherford back scattering measurements on this material indicate that the damage is still present even after the maximum possible heat treatment. Secondary ion mass spectrometry measurements have indicated a redistribution in the measured profiles of Mg due to annealing. 34 refs., 5 figs., 2 tabs.
Sponsoring Organization:
USDOE
DOE Contract Number:
AC05-96OR22464
OSTI ID:
484473
Journal Information:
Journal of Electronic Materials, Journal Name: Journal of Electronic Materials Journal Issue: 3 Vol. 26; ISSN JECMA5; ISSN 0361-5235
Country of Publication:
United States
Language:
English